IP Library › Assignment 063774/0853
Patent Assignment
Reel/Frame 063774/0853

Assignment of Assignor's Interest

Recorded: 2023-05-26 Pages: 6
Assignors
HUNG, HSIN YANG
Executed: 2022-03-27
DAI, WEI-SYUAN
Executed: 2023-04-20
CHIANG, TSUNG-YU
Executed: 2022-03-27
CHEN, LUNG
Executed: 2022-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Reduction of Damages to Source/Drain Features
Application: 17/745,996 →
Publication: US 2023/0135084