Patent Assignment
Reel/Frame 063777/0504
Assignment of Assignor's Interest
Recorded: 2023-05-26
Pages: 5
Assignor
HEO, DAEWOONG
Executed: 2023-04-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Application:
18/202,735 →
Publication:
US 2024/0087983