Patent Assignment
Reel/Frame 063797/0264
Assignment of Assignor's Interest
Recorded: 2023-05-30
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Manufacturing Method Thereof
Application:
18/203,294 →
Publication:
US 2024/0074050