Patent Assignment
Reel/Frame 063799/0296
Assignment of Assignor's Interest
Recorded: 2023-05-30
Pages: 4
Assignors
LEE, YONGTAEK
Executed: 2023-05-30
KIM, JAEMYEONG
Executed: 2023-05-30
LEE, DAAE
Executed: 2023-05-30
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive Devices