Patent Assignment
Reel/Frame 063801/0734
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 5
Assignors
TSAI, PEI-CHUN
Executed: 2023-01-30
HSU, HUNG-HSIN
Executed: 2022-12-20
CHANG CHIEN, SHANG-YU
Executed: 2023-01-30
LEE, CHIA-LING
Executed: 2022-12-20
Assignee
POWERTECH TECHNOLOGY INC.
NO. 10, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU TOWNSHIP, HSINCHU COUNTY (R.O.C), TAIWAN
Covered Property
(1)
Stacked Package Structure Including a Chip Disposed on a Redistribution Layer and a Molding Layer Comprises a Recess