IP Library › Assignment 063803/0117
Patent Assignment
Reel/Frame 063803/0117

Assignment of Assignor's Interest

Recorded: 2023-05-31 Pages: 5
Assignors
YU, CHIH-HAO
Executed: 2023-04-16
CHAO, JUI LIN
Executed: 2023-04-16
HSIA, HSING-KUO
Executed: 2023-04-23
TAI, SHIH-PENG
Executed: 2023-05-26
YEE, KUO-CHUNG
Executed: 2023-04-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Photonic Semiconductor Device, Photonic Semiconductor Package Using the Same and Manufacturing Method Thereof
Application: 18/099,059 →
Publication: US 2024/0118491
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Inventor's Execution Dates Previously Recorded at Reel: 063803 Frame: 0117. Assignor(S) Hereby Confirms the Assignment . Jan 4, 2024
From: YU, CHIH-HAO; CHAO, JUI LIN; HSIA, HSING-KUO; TAI, SHIH-PENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 066204/0952 →