Patent Assignment
Reel/Frame 063807/0526
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 5
Assignors
LIANG, SHUEN-SHIN
Executed: 2023-05-21
LEE, HONG-MAO
Executed: 2023-05-21
WANG, SUNG-LI
Executed: 2023-05-21
TSAI, YAN-MING
Executed: 2023-05-22
CHANG, PO-CHIN
Executed: 2023-05-23
LOH, WEI-YIP
Executed: 2023-05-23
CHIEN, HARRY
Executed: 2023-05-23
LEE, PEI-HUA
Executed: 2023-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Fabricating the Same
Application:
18/326,241 →
Publication:
US 2024/0405023