Patent Assignment
Reel/Frame 063807/0855
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 6
Assignors
TSAI, SHENG-HAN
Executed: 2022-08-01
HSU, CHOU-JUI
Executed: 2022-08-01
LIN, TSUNG-SHU
Executed: 2022-08-01
CHIU, YUAN SHENG
Executed: 2023-05-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Including Step Seal Ring and Methods Forming Same