Patent Assignment
Reel/Frame 063813/0583
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 15
Assignors
MAUSNER, STEFAN
Executed: 2023-04-18
CHAN, LI-SAN
Executed: 2023-02-17
KANG, SUNGSIG
Executed: 2023-02-16
SATTLER, MARTIN
Executed: 2023-03-17
MIRIC, ANTON-ZORAN
Executed: 2023-02-16
SCHEIBEL, MARKUS
Executed: 2023-02-20
Assignees
HERAEUS DEUTSCHLAND GMBH & CO. KG
HERAEUSSTRASSE 12 - 14, HANAU, 63450, GERMANY
HERAEUS MATERIALS SINGAPORE PTE. LTD.
BLOCK 5014, ANG MO KIO AVENUE 5, #07-01 TECHPLACE II, SINGAPORE, 569881, SINGAPORE
Covered Property
(1)
Process for the Manufacture of Encapsulated Semiconductor Dies and/or of Encapsulated Semiconductor Packages
Application:
18/255,299 →
Publication:
US 2024/0006191
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.