IP Library › Assignment 068409/0258
Patent Assignment
Reel/Frame 068409/0258

Assignment of Assignor's Interest

Recorded: 2024-06-05 Pages: 67
Assignor
HERAEUS DEUTSCHLAND GMBH & CO. KG
Executed: 2023-07-06
Assignee
HERAEUS ELECTRONICS GMBH & CO. KG
HERAEUSSTRAßE 12-14, HANAU, 63450, GERMANY
Covered Properties (40)
Height Adaptable Multilayer Spacer
Application: 18/067,404 →
Publication: US US20230197665A1
Method for Producing a Metal-Ceramic Substrate
Application: 17/808,908 →
Publication: US US20220410299A1
Method for Producing a Metal-Ceramic Substrate and Furnace
Application: 17/808,919 →
Publication: US US20220411339A1
Method for Structuring Metal-Ceramic Substrates, and Structured Metal Ceramic Substrate
Application: 18/261,607 →
Publication: US US20240074064A1
Silver Sintering Preparation and the Use Thereof for the Connecting of Electronic Components
Application: 17/301,642 →
Publication: US US20220324021A1
Process for the Manufacture of Encapsulated Semiconductor Dies and/or of Encapsulated Semiconductor Packages
Application: 18/255,299 →
Publication: US US20240006191A1
Production of Surface-Modified Cu Ribbons for Laser Bonding
Application: 18/044,936 →
Publication: US US20230386706A1
Layered Composite
Application: 18/044,155 →
Publication: US US20240025148A1
Coated Wire
Application: 18/263,655 →
Publication: US US20240084472A1
Sintering Paste and Use Thereof for Connecting Components
Application: 18/257,037 →
Publication: US US20240033860A1
Heat Exchange Compound Module
Application: 16/690,507 →
Publication: US US20210156626A1
Silver Sintering Preparation and the Use Thereof for the Connecting of Electronic Components
Application: 16/601,375 →
Solder Paste
Application: 17/756,875 →
Publication: US US20230001520A1
Metal Paste and Use Thereof for Joining Components
Application: 17/047,356 →
Publication: US US20210114102A1
Metal-Ceramic Substrate with a Foil Formed for Direct Cooling as Substrate Bottom
Application: 17/259,406 →
Publication: US US20210125895A1
Multi-Component Composition for Producing an Aqueous Coating Mass
Application: 17/844,261 →
Publication: US US20220315491A1
Composition for Producing an Aqueous Coating Mass
Application: 16/629,839 →
Publication: US US20210087111A1
Laser Cutting of Metal-Ceramic Substrates
Application: 16/624,074 →
Publication: US US20200398372A1
Ceramic-Metal Substrate with Low Amorphous Phase
Application: 16/607,556 →
Publication: US US20200098696A1
Copper/Ceramic Composite
Application: 16/078,141 →
Publication: US US20200308072A1
Copper-Ceramic Composite
Application: 16/078,182 →
Publication: US US20190055166A1
Copper-Ceramic Composite
Application: 16/078,662 →
Publication: US US20190055167A1
Copper-Ceramic Composite
Application: 16/078,676 →
Publication: US US20190084893A1
Method for Producing a Substrate Adapter and Substrate Adapter for Connecting to an Electronic Component
Application: 16/704,145 →
Publication: US US20200180294A1
Metal Paste and Use Thereof for Joining Components
Application: 15/580,750 →
Publication: US US20180147673A1
Coated Wire
Application: 15/778,009 →
Publication: US US20180345421A1
Method for Producing a Substrate Arrangement, Substrate Arrangement, and Method for Connecting a Substrate Arrangement to an Electronic Component
Application: 15/766,234 →
Publication: US US20180286831A1
Solder Paste
Application: 15/506,353 →
Publication: US US20170252873A1
Method for Producing a Silver Sintering Agent Having Silver Oxide Surfaces and Use of Said Agent in Methods for Joining Components by Pressure Sintering
Application: 15/329,768 →
Publication: US US20170223840A1
Semiconductor Module Comprising an Encapsulating Compound That Covers at Least One Semiconductor Component
Application: 15/974,930 →
Publication: US US20180261518A1
Carrier and Clip Each Having Sinterable, Solidified Paste for Connection to a Semiconductor Element, Corresponding Sintering Paste, and Corresponding Production Method and Use
Application: 15/129,250 →
Publication: US US20170117209A1
Semi-Conductor Module with an Encapsulating Cement Mass That Covers a Semi-Conductor Component
Application: 15/034,626 →
Publication: US US20160260648A1
Solder Paste with Oxalic Acid and Amine Component
Application: 15/105,169 →
Publication: US US20160311067A1
Sinter Paste with Coated Silver Oxide on Noble and Non-Noble Surfaces That Are Difficult to Sinter
Application: 15/968,712 →
Publication: US US20180311774A1
Aluminum Coated Copper Ribbon
Patent: 9,214,444 →
Application: 14/399,003 →
Publication: US US20150137390A1
Aluminum Coated Copper Bond Wire and Method of Making the Same
Patent: 9,966,355 →
Application: 14/399,351 →
Publication: US US20150155252A1
Contacting Means and Method for Contacting Electrical Components
Patent: 8,925,789 →
Application: 13/224,514 →
Publication: US US20120055978A1
Metal Paste with Co-Precursors
Patent: 8,950,653 →
Application: 13/393,241 →
Publication: US US20120153012A1
Metal Paste with Oxidizing Agents
Patent: 8,950,652 →
Application: 13/393,032 →
Publication: US US20120153011A1
Method for Refining and Homogeneously Distributing Alloying Partners and for Removing Undesirable Reaction Products and Slags in or from Soft Solder During the Production of Fine Solder Powder
Patent: 7,331,498 →
Application: 11/193,758 →
Publication: US US20060208042A1
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 13, 2019
From: CHEW, LY MAY; SUH, SEIGI; SHAHBAZI, SAMSON; SCHMITT, WOLFGANG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 051001/0414 →
Assignment of Assignor's Interest Jan 13, 2020
From: SCHEIBEL, MARKUS; DRASKOVIC, TAMARA
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 051490/0885 →
Assignment of Assignor's Interest Jan 24, 2020
From: ROGG, ALEXANDER; LISCA, BOGDAN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 051605/0272 →
Assignment of Assignor's Interest Feb 4, 2020
From: DIETRICH, PETER; PERSONS, RYAN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 051711/0219 →
Assignment of Assignor's Interest May 20, 2020
From: ROGG, ALEXANDER; LISCA, BOGDAN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 052711/0711 →
Assignment of Assignor's Interest Oct 13, 2020
From: SCHWARZER, CHRISTIAN; SCHMITT, WOLFGANG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 054043/0765 →
Assignment of Assignor's Interest Mar 2, 2021
From: DIETRICH, PETER
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 055470/0537 →
Assignment of Assignor's Interest Apr 20, 2021
From: CHEW, LY M; BERUBE, GREGORY; SUH, SEIGI
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 055979/0783 →
Assignment of Assignor's Interest Jun 3, 2022
From: WANG, LEI; FRITZSCHE, SEBASTIAN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 060100/0029 →
Assignment of Assignor's Interest Jun 21, 2022
From: SCHEIBEL, MARKUS
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 060268/0041 →
Assignment of Assignor's Interest Jun 24, 2022
From: SCHWOBEL, ANDRE; SCHNEE, DANIEL; MIRIC, ANTON-ZORAN; WACKER, RICHARD
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 060310/0124 →
Assignment of Assignor's Interest Jun 24, 2022
From: SCHWOBEL, ANDRE; SCHNEE, DANIEL; WACKER, RICHARD; MIRIC, ANTON-ZORAN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 060310/0406 →
Assignment of Assignor's Interest Dec 16, 2022
From: HINRICH, ANDREAS
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 062129/0423 →
Assignment of Assignor's Interest Mar 6, 2023
From: SCHEIBEL, MARKUS; MIRIC, ANTON-ZORAN; ALBERT, TAMARA
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 062894/0634 →
Assignment of Assignor's Interest Mar 10, 2023
From: NEUBAUER, MARCEL; KRÜGER, FRANK
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 062950/0146 →
Assignment of Assignor's Interest May 31, 2023
From: MAUSNER, STEFAN; CHAN, LI-SAN; KANG, SUNGSIG; SATTLER, MARTIN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG; HERAEUS MATERIALS SINGAPORE PTE. LTD.
Reel/Frame 063813/0583 →
Assignment of Assignor's Interest Jun 12, 2023
From: CHEW, LY MAY; SCHMITT, WOLFGANG; SCHÄFER, MICHAEL
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 063924/0603 →
Assignment of Assignor's Interest Jul 14, 2023
From: WACKER, RICHARD; SCHNEE, DANIEL; SCHWÖBEL, ANDRE; SCHARF, JUERGEN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 064261/0569 →
Assignment of Assignor's Interest Jul 31, 2023
From: SARANGAPANI, MURALI; SEE THO, WAI KHEE; DHAYALAN, MARIYAPPAN; KANG, SUNGSIG
To: HERAEUS MATERIALS SINGAPORE PTE. LTD.; HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 064439/0506 →