Heat exchange compound module
The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.
1. A heat exchange compound module, comprising:
a metal-ceramic substrate comprising an outer layer of a first metallic material, and
a heat exchange structure made of a second metallic material, the second metallic material comprising 95 to 99.99% aluminum,
wherein the heat exchange structure is connected to the outer layer of the metal-ceramic substrate only by a eutectic bond between the first metallic material and the second metallic material, and wherein the eutectic bond consists of a homogeneous mixture of the first metallic material and the second metallic material.
2. The module of claim 1 , wherein the heat exchange structure is a direct cooling device.
3. The module of claim 1 , wherein the heat exchange structure is a pin fin cooler.
4. The module of claim 3 , wherein the pin fin cooler comprises a plurality of single, non-interconnected pin fins.
5. The module of claim 1 , wherein the heat exchange structure is a heat sink.
6. The module of claim 1 , wherein the heat exchange structure is connected to the outer layer of the metal-ceramic substrate by a heat diffusion process.
7. The module of claim 1 , wherein the first metallic material comprises copper as major component.
8. The module of claim 1 , wherein the metal-ceramic substrate is a sandwich comprising the outer layer of the first metallic material as a first outer layer, followed by a ceramic core and followed by a second outer layer of a metallic material.
9. The module of claim 1 , wherein the metal-ceramic substrate comprises another outer layer of a metallic material, wherein the another outer layer is at least partly structured to form electrical contact areas.
10. The module of claim 1 , wherein the first metallic material comprises 80 to 99.9% copper.
11. A manufacturing method for a heat exchange compound module, comprising the following steps:
providing a metal-ceramic substrate comprising an outer layer of a first metallic material, applying a heat exchange structure made of a second metallic material on the metal-ceramic substrate to form a heat exchange compound module, the second metallic material comprising 95 to 99.9% aluminum, and
heating the heat exchange compound module to a eutectic temperature of the first metallic material and the second metallic material, at which the heat exchange structure connects to the outer layer of the metal-ceramic substrate only by a eutectic bond between the first metallic material and the second metallic material, wherein the eutectic bond consists of a homogeneous mixture of the first metallic material and the second metallic material.
12. The method of claim 11 , wherein the first metallic material comprises copper as a major component.
13. The method of claim 11 , wherein the eutectic temperature is in a range of 530° C. to 570° C.
14. The method of claim 11 , wherein the heating is done in an inert atmosphere.
15. The method of claim 11 , further comprising a step of applying a weight on the heat exchange compound module before heating the heat exchange compound module.
16. The method of claim 11 , wherein the heat exchange structure is a direct cooling device.
17. The method of claim 11 , wherein the heat exchange structure is a pin fin cooler.
18. The method of claim 11 , wherein the heat exchange structure is a heat sink.
19. The method of claim 11 , wherein the first metallic material comprises 80 to 99.9% copper.