Metal paste and use thereof for joining components
A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist 70 to 100 wt % of organically coated copper flakes having a specific surface area in the range of 1.9 to 3.7 m 2 /g, a total oxygen content in the range of 2 to 4 wt % and a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.
1. A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist of 70 to 100 wt % of organically coated copper flakes having
a specific surface area in the range of 1.9 to 3.7 m 2 /g,
a total oxygen content in the range of 2 to 4 wt %, and
a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.
2. The metal paste according to claim 1 , wherein the organically coated copper flakes are thin plates measuring 40 to 200 nm having an aspect ratio in the range of 6:1 to 375:1.
3. The metal paste according to claim 1 , wherein the organically coated copper flakes have a mean particle size (d50) in the range of 1 to 15 μm.
4. The metal paste according to claim 1 , wherein the organic coating forms a bonded and non-volatile layer on the surface of the copper flake at 20° C. and atmospheric pressure.
5. The metal paste according to claim 1 , wherein the organic coating comprises at least one type of organic coating compounds.
6. The metal paste according to claim 1 , wherein the organic coating is 2 to 5 wt % of the organically coated copper flakes.
7. The metal paste according to claim 1 , wherein the organically coated copper flakes have a coating level of 0.004 to 0.006 g/m 2 .
8. The metal paste according to claim 1 , wherein the organically coated copper flakes are made of flakes made of copper alloys having up to 30 wt % of at least one alloy metal.
9. The metal paste according to claim 8 , wherein the at least one alloy metal is selected from the group consisting of silver, gold, nickel, palladium, platinum, zinc, and aluminum.
10. The metal paste according to claim 1 , further comprising up to 15 wt % of at least one additive (C) selected from the group consisting of metal precursors, sintering aids, dispersing agents, surfactants, defoaming agents, binding agents, polymers, and viscosity-controlling agents.
11. A method for joining components, the method comprising:
preparing a sandwich arrangement that includes at least one component 1, one component 2 and one metal paste according to claim 1 , the metal paste located between contact surfaces of component 1 and component 2; and
bonding the contact surfaces of component 1 and component 2 by sintering the metal paste.
12. The method according to claim 11 , wherein at least one of the contact surfaces that are to be bonded by sintering is a contact surface made of copper or of a metallized copper.
13. The method according to claim 11 , wherein sinter bonding occurs while applying pressure, or pressureless.
14. The method according to claim 11 , wherein the one component 1 and the one component 2 are parts that are used in electronics.
15. The method according to claim 11 , wherein the sinter bonding occurs within a temperature range of 250 to 350° C.
16. The method according to claim 1 , wherein the total oxygen content is in the range of 2.5 to 4 wt %.
17. The metal paste according to claim 1 , wherein the organically coated copper flakes are made of pure copper flakes.
18. The metal paste according to claim 1 , wherein the organically coated copper flakes are made of pure copper flakes and flakes made of copper alloys having up to 30 wt % of at least one alloy metal.
19. The metal paste according to claim 1 , wherein the metal paste comprises 70 to 80 wt % of the metal particles and 15 to 30 wt % of the organic solvent.
20. The metal paste according to claim 1 , wherein the metal paste comprises 72 to 78 wt % of the metal particles and 17 to 28 wt % of the organic solvent.