Solder paste with oxalic acid and amine component
A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.
1. A soldering paste comprising:
a) a flux comprising:
i) adipic acid;
ii) oxalic acid; and
iii) an amine selected from the group consisting of amine component A and amine component B, wherein amine component A is selected from the group consisting of 1,2-tetramethylethylenediamine, 1,2-tetraethylethylenediamine, and 1,2-tetrapropylethylenediamine and wherein amine component B is selected from the group consisting of N-coco-1,3-diaminopropane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, and 1,10-diaminodecane; and
b) a solder,
wherein the flux does not contain a metal.
2. The soldering paste according to claim 1 , wherein the flux comprises amine component A and/or amine component B in an amount of 0.1 to 2.0% by weight relative to a total weight of the flux.
3. The soldering paste according to claim 1 , wherein the flux comprises adipic acid in an amount of 7 to 13% by weight relative to a total weight of the flux.
4. The soldering paste according to claim 1 , wherein the flux comprises oxalic acid in an amount of 0.3 to 2.0% by weight relative to a total weight of the flux.
5. The soldering paste according to claim 1 , wherein the flux comprises additional dicarboxylic acids other than oxalic acid and adipic acid in an amount of 0 to 2% by weight relative to a total weight of the flux.
6. The soldering paste according to claim 5 , wherein a total amount of all dicarboxylic acids in the flux is maximally 15% by weight relative to the total weight of the flux.
7. The soldering paste according to claim 1 , wherein the flux further comprises a monoamine, relative to the total weight of the flux, wherein the monoamine is selected from the group consisting of secondary monoamine and tertiary monoamine.
8. The soldering paste according to claim 1 , wherein the solder is a tin-based solder.
9. The soldering paste according to claim 1 , wherein the soldering paste comprises solder in an amount of 80 to 97% by weight relative to a total weight of the soldering paste.
10. A module comprising:
1) a component with electrical connecting sites having a first surface;
2) a substrate with at least one second surface; and
3) a soldering paste according to claim 1 that directly contacts the first surface and the at least one second surface.
11. A method for producing a soldering paste according to claim 1 , the method comprising the steps of:
mixing components of the flux together to form a mixture; and
adding a solder powder to the mixture.
12. A method for mounting a component on a substrate comprising the following steps:
a) providing a component having electrical connecting sites;
b) providing a substrate, the substrate comprising a surface that is provided with a soldering paste according to claim 1 ;
c) contacting a surface of the component to the surface of the substrate by the soldering paste; and
d) heating the soldering paste beyond a liquidus temperature of the solder.