Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
A semi-conductor module with an encapsulating mass that covers a semi-conductor component, in which the encapsulating mass is cement.
1. A semi-conductor module comprising a semi-conductor component, a substrate, an encapsulating mass, a protective layer on the encapsulating mass, an insulating mass, and bond wires, wherein the encapsulating mass is an electrically insulating cement produced from magnesium oxide, zirconium silicate, and magnesium phosphate raw materials, the encapsulating mass is in a form of a “glob-top” or droplet which encapsulates at least the semi-conductor component and at least partly encapsulates the bond wires, wherein a plurality of surfaces of the substrate that provide electrical and thermal contact are not encapsulated, wherein the insulating mass fully encapsulates the semi-conductor component, the substrate, and the encapsulating mass, wherein the protective layer comprises a moisture-resistant coating comprising a set epoxy resin, and wherein the bond wires are connected to the semi-conductor component.
2. The semi-conductor module according to claim 1 , wherein the cement comprises an aggregate aluminum nitride, boron nitride, aluminum oxide and/or silicon nitride.
3. The semi-conductor module according to claim 1 , wherein the cement comprises a fibrous component dispersed therein.
4. The semi-conductor module according to claim 1 , further comprising at least one cooling element physically connected to the cement.
5. The semi-conductor module according to claim 4 , wherein the cooling element is an air-cooled or a liquid-cooled cooling element.
6. The semi-conductor module according to claim 1 , wherein the semi-conductor module is a power electronics sub-assembly.
7. The semi-conductor module according to claim 1 , wherein the insulating mass is a silicone gel.
8. A semi-conductor module having no frame and comprising a semi-conductor component, a substrate, bond wires, an encapsulating mass, and a protective layer on the encapsulating mass, wherein the encapsulating mass is an electrically insulating cement produced from magnesium oxide, zirconium silicate, and magnesium phosphate raw materials, wherein the bond wires are connected to the semi-conductor component, and wherein the encapsulating mass fully encapsulates the semi-conductor component and the substrate and at least partly encapsulates the bond wires, wherein a plurality of surfaces of the substrate that provide electrical and thermal contact are not encapsulated, and wherein the protective layer comprises a moisture-resistant coating comprising a set epoxy resin.
9. The semi-conductor module according to claim 8 , wherein the cement comprises an aggregate aluminum nitride, boron nitride, aluminum oxide and/or silicon nitride.
10. The semi-conductor module according to claim 8 , wherein the cement comprises a fibrous component dispersed therein.
11. The semi-conductor module according to claim 8 , further comprising at least one cooling element physically connected to the cement.
12. The semi-conductor module according to claim 11 , wherein the cooling element is an air-cooled or a liquid-cooled cooling element.
13. The semi-conductor module according to claim 8 , wherein the semi-conductor module is a power electronics sub-assembly.
14. The semi-conductor module according to claim 1 , wherein the substrate comprises a ceramic.
15. The semi-conductor module according to claim 8 , wherein the substrate comprises a ceramic.