Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.
1. A method for manufacturing a substrate assembly for attachment to an electronic component, the method comprising:
providing a substrate with a first side and a second side;
applying a contact material layer to the first side of the substrate such that the substrate has a lateral edge on which no contact material is applied;
applying a pre-fixing agent at least to sections of a side of the contact material layer facing away from the substrate;
positioning the substrate with applied contact material layer and applied pre-fixing agent on a carrier film such that the first side of the substrate is arranged to face the carrier, and wherein the pre-fixing agent is at least adhesively bonded with the carrier;
separating the substrate, while applied to the carrier film, into multiple substrate assemblies, including separating from the substrate the lateral edges on which no contact material is applied.
2. The method of claim 1 , wherein the substrate is one of a group comprising a metal sheet, a metal band section, a copper sheet, a copper band section, a lead frame, a DCB substrate, and a PCB substrate.
3. The method of claim 1 , wherein the substrate or a substrate blank is coated on at least one side with a material comprising one of gold (Au), nickel-gold (NiAu), silver (Ag), nickel-silver (NiAg), nickel-palladium-gold (NiPdAu), by galvanising or chemical plating.
4. The method of claim 1 , wherein the contact material layer applied to the substrate has a layer thickness in a range comprising one of from 10-150 μm, from 30-100 μm, and from 40-80 μm.
5. The method of claim 1 , wherein after a contact material layer is applied, the substrate has a lateral edge on which no contact material layer has been applied, and wherein the edge has such a width (b R ) that is not more than 20% of the total width (b S ) of the substrate.
6. The method of claim 1 , wherein at least sections of a lateral edge of the substrate, in the state in which it is attached to the carrier, are detached and/or the substrate is structured and/or separated, in the state in which it is attached to the carrier.
7. The method of claim 6 , wherein the detachment of the lateral edge and/or the structuring of the substrate and/or the separation of the substrate is/are carried out by means of laser.
8. The method of claim 6 , wherein at least sections of the contact material layer and/or the pre-fixing agent is/are detached and/or structured and/or separated when the lateral edge is detached and/or when the substrate is structured and/or when the substrate is separated.
9. The method of claim 1 , wherein contact material of the contact material layer comprises auxiliary sintering agent and silver particles, and wherein the pre-fixing agent comprises the same auxiliary sintering agent.
10. The method of claim 1 , contact material comprising a sintering paste including metal particles and auxiliary sintering agents, the pre-fixing agent being a sintering agent of the sintering paste.
11. The method of claim 10 , the auxiliary sintering agents being at least one of organic compounds, fatty acids, and binding agents.