IP Library Granted Patent US 11,021,406
Granted Patent B2
US 11,021,406 · App. 16/078,676 · Granted Jun 1, 2021

Copper-ceramic composite

Inventors: Kai Herbst (Erlangen, DE); Christian Muschelknautz (Darmstadt, DE)
Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
C04B37/021H05K3/245H05K3/4623C04B2235/78C04B2235/781C04B2235/782C04B2235/784C04B2235/785C04B2235/786C04B2237/34C04B2237/343C04B2237/36C04B2237/407C04B2237/704C04B2237/706
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Quick Facts
Patent No.
US 11,021,406
App. No.
16/078,676
Granted
Jun 1, 2021
Kind
B2
Abstract

The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 μm to 300 μm.

Claims (27)

1. A copper-ceramic composite comprising:

a ceramic substrate,

a coating which is present on the ceramic substrate and is composed of copper or a copper alloy,

wherein the copper or the copper alloy has

grain sizes in the range from 10 μm to 300 μm;

a grain size number distribution having a d 95 in the range from 140 μm to 250 μm; and

an average grain shape factor R a (Cu) of greater than or equal to 0.60, wherein the average grain shape factor R a (Cu) is obtained from the arithmetic mean of the shape factors R K of the individual grains, the shape factor R K of each individual grain being d K,ortho /d K,max , wherein d K,max is the maximum grain diameter and d K,ortho is the grain diameter running perpendicular to d K,max , determined on half the length of d K,max , and

wherein the coating composed of copper or a copper alloy is applied by means of a DCB process to the ceramic substrate.

2. The copper-ceramic composite of claim 1 , wherein the copper or the copper alloy has a number distribution of the grain sizes having a median d 50 in the range from 55 μm to 115 μm.

3. The copper-ceramic composite of claim 1 , wherein the d 95 is in the range from 140 μm to 230 μm.

4. The copper-ceramic composite of claim 1 , wherein the grain size number distribution of the copper or the copper alloy has a d 5 of greater than or equal to 15 μm.

5. The copper-ceramic composite of claim 1 , wherein the grain sizes of the copper or of the copper alloy are in the range from 15 μm to 250 μm.

6. The copper-ceramic composite of claim 1 , wherein the coating composed of copper or a copper alloy has a thickness D Cu and the grain size number distribution of the copper or the copper alloy has a median d 50 value, the ratio of the D Cu to the median d 50 value being in the range from 0.05 to 0.40, wherein the thickness D Cu and the median d 50 value have the same unit of measure for determination of the ratio of the D Cu to the median d 50 value.

7. The copper-ceramic composite of claim 1 , wherein the coating composed of copper or a copper alloy at least partly has structuring to form electrical contact areas.

8. The copper-ceramic composite of claim 1 , wherein the ceramic substrate contains an oxide, a nitride, a carbide or a mixture or composite of at least two of these materials.

9. The copper-ceramic composite of claim 1 , wherein the ceramic substrate contains at least 65% by weight of Al 2 O 3 .

10. The copper-ceramic composite of claim 1 , wherein the coating composed of copper or a copper alloy has a thickness in the range of 0.2-1.2 mm over at least 70% of its area.

11. A module containing at least one copper-ceramic composite according to claim 1 and one or more bond wires.

12. The copper-ceramic composite of claim 4 , wherein the d 5 is in the range from 15 μm to 80 μm.

13. The copper-ceramic composite of claim 10 , wherein the ceramic substrate has a thickness in the range of 0.2-1.2 mm over at least 70% of its area.

14. The copper-ceramic composite of claim 1 , wherein the ceramic substrate has a thickness in the range of 0.2-1.2 mm over at least 70% of its area.

15. The copper-ceramic composite of claim 1 , wherein the average grain shape factor R a (Cu) of the copper or the copper alloy is greater than or equal to 0.60 and less than or equal to 1.0.

16. The copper-ceramic composite of claim 1 , further comprising copper-aluminum spinels located between the ceramic substrate and the coating.

17. The copper-ceramic composite of claim 9 , wherein the Al 2 O 3 is in the form of grains, the grains having

grain sizes in the range from 0.01 μm to 25 μm; and

a grain size number distribution having a d 95 in the range from 4.0 μm to 15.0 μm.

18. The copper-ceramic composite of claim 9 , wherein the Al 2 O 3 grains have an average grain shape factor R a (Al 2 O 3 ) of greater than or equal to 0.40, wherein the average grain shape factor R a (Al 2 O 3 ) is obtained from the arithmetic mean of the shape factors R K of the individual grains, the shape factor R K of each individual grain being d K,ortho /d K,max , wherein d K,max is the maximum grain diameter and d K,ortho is the grain diameter running perpendicular to d K,max , determined on half the length of d K,max .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2024
From: HERAEUS DEUTSCHLAND GMBH & CO. KG
To: HERAEUS ELECTRONICS GMBH & CO. KG
Reel/Frame 068409/0258 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2018
From: HERBST, KAI; MUSCHELKNAUTZ, CHRISTIAN
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 046658/0088 →