IP Library Assignment 063819/0633
Patent Assignment
Reel/Frame 063819/0633

Assignment of Assignor's Interest

Recorded: 2023-06-01 Pages: 4
Assignors
NAKAKO, HIDEO
Executed: 2023-05-09
TANAKA, TOSHIAKI
Executed: 2023-05-09
ISHIKAWA, DAI
Executed: 2023-05-10
EJIRI, YOSHINORI
Executed: 2023-05-18
NATORI, MICHIKO
Executed: 2023-05-18
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Copper Paste, Wick Formation Method, and Heat Pipe
Application: 18/026,244 →
Publication: US 2023/0356294
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →