Patent Assignment
Reel/Frame 063824/0290
Assignment of Assignor's Interest
Recorded: 2023-06-01
Pages: 6
Assignors
YANG, HAO-LIN
Executed: 2023-05-31
HUANG, KUAN-CHIEH
Executed: 2023-04-17
HSU, WEI-CHENG
Executed: 2023-04-18
WANG, TZU-JUI
Executed: 2023-04-17
WANG, CHEN-JONG
Executed: 2023-04-17
YAUNG, DUN-NIAN
Executed: 2023-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Signal Shielding for Integrated Circuits
Application:
18/297,177 →
Publication:
US 2024/0339475