Patent Assignment
Reel/Frame 063829/0075
Assignment of Assignor's Interest
Recorded: 2023-06-01
Pages: 7
Assignors
LIN, MENG-HAN
Executed: 2023-02-12
YEONG, SAI-HOOI
Executed: 2023-02-10
HUANG, CHIA-EN
Executed: 2022-09-18
CHUI, CHI ON
Executed: 2022-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Memory Device and Method
Application:
18/152,585 →
Publication:
US 2024/0015976