Patent Assignment
Reel/Frame 063832/0889
Assignment of Assignor's Interest
Recorded: 2023-06-01
Pages: 7
Assignors
WATANABE, TAIICHIRO
Executed: 2019-12-24
KOGA, FUMIHIKO
Executed: 2019-12-24
ITO, KYOSUKE
Executed: 2020-01-16
TOGASHI, HIDEAKI
Executed: 2019-12-26
SUGIMORI, YUSAKU
Executed: 2020-01-07
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1, ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Imaging Element, Stacked Imaging Element, and Solid-State Imaging Apparatus