Patent Assignment
Reel/Frame 063835/0827
Assignment of Assignor's Interest
Recorded: 2023-06-02
Pages: 6
Assignors
CHOU, LU-SHENG
Executed: 2022-03-24
TSENG, HSUAN-HAN
Executed: 2022-03-27
CHEN, CHUN-YUAN
Executed: 2023-06-02
TSENG, HSIAO-HUI
Executed: 2022-03-25
WANG, CHING-CHUN
Executed: 2022-03-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal-Insulator-Metal Device Capacitance Enhancement