Patent Assignment
Reel/Frame 063839/0622
Assignment of Assignor's Interest
Recorded: 2023-06-02
Pages: 9
Assignors
WU, CHENG-TA
Executed: 2020-10-27
HSIEH, CHIA-TA
Executed: 2020-08-10
WU, KUO WEI
Executed: 2020-08-10
CHANG, YU-CHUN
Executed: 2020-08-10
TSENG, YING LING
Executed: 2020-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor-On-Insulator (Soi) Substrate and Method for Forming