Patent Assignment
Reel/Frame 063853/0806
Assignment of Assignor's Interest
Recorded: 2023-06-05
Pages: 3
Assignor
UZOH, CYPRIAN EMEKA
Executed: 2023-06-05
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct Bonding Methods and Structures
Application:
18/179,126 →
Publication:
US 2024/0304593