Assignment of Assignor's Interest

Recorded: 2023-06-05 Pages: 7

Assignors

RIM, KERN

Executed: 2023-05-19

LEE, DOO HYUN

Executed: 2023-05-19

SHIN, HEON JONG

Executed: 2023-05-19

PARK, JIN YOUNG

Executed: 2023-05-23

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Nanosheet Semiconductor Device Having a Through via Extending Through a Source/Drain Region Between Two Active Region Separation Cuts

Application: 18/205,814 →

Publication: US 2024/0162120