Patent Assignment
Reel/Frame 063858/0556
Assignment of Assignor's Interest
Recorded: 2023-06-05
Pages: 4
Assignors
KING, YA-CHIN
Executed: 2023-05-25
LIN, CHRONG JUNG
Executed: 2023-05-25
LIN, BURN JENG
Executed: 2023-05-25
HUANG, YAO-HUNG
Executed: 2023-05-25
CHANG, WEI
Executed: 2023-05-25
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
NATIONAL TSING HUA UNIVERSITY
NO. 101, SEC. 2, KUANG FU RD., HSINCHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/328,037 →
Publication:
US 2024/0405087