Patent Assignment
Reel/Frame 063862/0406
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 5
Assignors
CHANG, CHIA-SHUAI
Executed: 2023-05-18
YU, WEN-FU
Executed: 2023-05-18
HWANG, BAE-YINN
Executed: 2023-05-18
WANG, WEI-LI
Executed: 2023-05-18
LIN, CHIEN-HUNG
Executed: 2023-05-18
Assignee
TONG HSING ELECTRONIC INDUSTRIES, LTD.
6 F., NO. 83, YANPING S. RD., ZHONGZHENG DIST.,, TAIPEI CITY, 10043, TAIWAN
Covered Property
(1)
Sensor Chips Having Columnar Microstructures Embedded and Surrounded by Adhesive Layer in a Package Structure and Manufacturing Method Thereof