Patent Assignment
Reel/Frame 063863/0332
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 6
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 1008310, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Substrate and Method of Manufacturing Semiconductor Device
Application:
18/265,434 →
Publication:
US 2024/0030055