Patent Assignment
Reel/Frame 063869/0376
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 3
Assignor
KUO, FENG-WEI
Executed: 2023-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Fabricating the Same
Application:
18/329,690 →
Publication:
US 2024/0411086