Patent Assignment
Reel/Frame 063869/0848
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 5
Assignors
HOU, YUNG-CHIN
Executed: 2023-05-30
LU, LEE-CHUNG
Executed: 2023-05-30
CHENG, YI-KAN
Executed: 2023-05-30
TZENG, JIANN-TYNG
Executed: 2023-06-05
LIN, WEI-CHENG
Executed: 2023-05-30
HUANG, CHING-YU
Executed: 2023-06-04
LIN, CHUN-YEN
Executed: 2023-05-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing
Application:
18/330,074 →
Publication:
US 2024/0274585