Patent Assignment
Reel/Frame 063871/0914
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 4
Assignee
LG INNOTEK CO., LTD.
30, MAGOKJUNGANG 10-RO, GANGSEO-GU, SEOUL, 07796, KOREA, REPUBLIC OF
Covered Property
(1)
Resin Composition for Semiconductor Package, Resin Coated Copper, and Circuit Board Comprising Same