Granted Patent B2

US 12,466,936 · App. 18/265,393 · Granted Nov 11, 2025

Inventors: Yong Suk Kim (Seoul, KR); Jeong Han Kim (Seoul, KR)

Assignee: LG INNOTEK CO., LTD.

C08K3/36C08J5/24C08K3/22H05K1/0373C08J2327/18C08J2361/06C08J2363/00C08K2003/2227C08K2003/2241C08K2003/2244C08K2201/003H05K2201/0263

Abstract

Claims (67)

1 . A resin composition for a semiconductor package, comprising:

an insulating layer comprising a resin composition that is a composite of a resin and a filler disposed in the resin,

wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition,

wherein the filler includes first to third filler groups having different diameters,

wherein a diameter of the second filler group is smaller than a diameter of the first filler group and greater than a diameter of the third filler group,

wherein a content of the second filler group is greater than a content of each of the first and third filler groups,

wherein the diameter of the first filler group satisfies a range of 2 μm to 3.5 μm,

wherein the diameter of the second filler group satisfies a range of 1 μm to 2 μm,

wherein the diameter of the third filler group satisfies a range of 0.5 μm to 1 μm, and

wherein the insulating layer has a dielectric constant of 2.9 to 3.2 Dk.

2 . The resin composition of claim 1 , wherein the diameter of the third filler group is smaller than the diameter of the first filler group, and

wherein the content of the third filler group is greater than the content of the first filler group.

3 . The resin composition of claim 2 , wherein the content of the first filler group satisfies a range of 5 wt % to 20 wt %,

wherein the content of the second filler group satisfies a range of 60 wt % to 80 wt %, and

wherein the content of the third filler group satisfies a range of 10 wt % to 30 wt %.

4 . The resin composition of claim 1 , wherein the filler further includes a fourth filler group having a smaller diameter than the diameter of the third filler group.

5 . The resin composition of claim 4 , wherein the diameter of the fourth filler group satisfies a range of 0.1 μm to 0.5 μm.

6 . The resin composition of claim 4 , wherein the content of the first filler group satisfies a range of 1 wt % to 15 wt %,

wherein the content of the second filler group satisfies a range of 50 wt % to 70 wt %,

wherein the content of the third filler group satisfies a range of 15 wt % to 35 wt %, and

wherein a content of the fourth filler group satisfies a range of 5 wt % to 20 wt %.

7 . The resin composition of claim 1 , wherein a dielectric constant of the resin composition has a range between 2.9 and 3.2 by a combination of the resin and the filler.

8 . A resin coated copper (RCC) comprising:

an insulating layer; and

a copper foil layer coated on at least one surface of the insulating layer,

wherein the insulating layer includes a resin and a filler,

wherein the filler includes first to third filler groups having different diameters,

wherein a diameter of the second filler group is smaller than a diameter of the first filler group and greater than a diameter of the third filler group,

wherein a content of the second filler group is greater than a content of each of the first and third filler groups,

wherein the diameter of the first filler group satisfies a range of 2 μm to 3.5 μm,

wherein the diameter of the second filler group satisfies a range of 1 μm to 2 μm,

wherein the diameter of the third filler group satisfies a range of 0.5 μm to 1 μm, and

wherein the insulating layer has a dielectric constant of 2.9 to 3.2 Dk.

9 . The RCC of claim 8 , wherein the diameter of the third filler group is smaller than the diameter of the first filler group, and

wherein the content of the third filler group is greater than the content of the first filler group.

10 . The RCC of claim 9 , wherein the content of the first filler group satisfies a range of 5 wt % to 20 wt %,

wherein the content of the second filler group satisfies a range of 60 wt % to 80 wt %, and

wherein the content of the third filler group satisfies a range of 10 wt % to 30 wt %.

11 . The RCC of claim 8 , wherein the filler further includes a fourth filler group having a smaller diameter than the diameter of the third filler group, and

wherein the diameter of the fourth filler group satisfies a range of 0.1 μm to 0.5 μm.

12 . The RCC of claim 11 , wherein the content of the first filler group satisfies a range of 1 wt % to 15 wt %,

wherein the content of the second filler group satisfies a range of 50 wt % to 70 wt %,

wherein the content of the third filler group satisfies a range of 15 wt % to 35 wt %, and

wherein a content of the fourth filler group satisfies a range of 5 wt % to 20 wt %.

13 . A circuit board comprising:

an insulating layer;

a circuit pattern disposed on the insulating layer; and

a via passing through the insulating layer,

wherein the insulating layer includes a resin and a filler,

wherein the filler includes first to third filler groups having different diameters,

wherein a diameter of the second filler group is smaller than a diameter of the first filler group and greater than a diameter of the third filler group,

wherein a content of the second filler group is greater than a content of each of the first and third filler groups,

wherein the diameter of the first filler group satisfies a range of 2 μm to 3.5 μm,

wherein the diameter of the second filler group satisfies a range of 1 μm to 2 μm,

wherein the diameter of the third filler group satisfies a range of 0.5 μm to 1 μm, and

wherein the insulating layer has a dielectric constant of 2.9 to 3.2 Dk.

14 . The circuit board of claim 13 , wherein the diameter of the third filler group is smaller than the diameter of the first filler group, and

wherein the content of the third filler group is greater than the content of the first filler group.

15 . The circuit board of claim 14 , wherein the content of the first filler group satisfies a range of 5 wt % to 20 wt %,

wherein the content of the second filler group satisfies a range of 60 wt % to 80 wt %, and

wherein the content of the third filler group satisfies a range of 10 wt % to 30 wt %.

16 . The circuit board of claim 13 , wherein the filler further includes a fourth filler group having a smaller diameter than the diameter of the third filler group, and

wherein the diameter of the fourth filler group satisfies a range of 0.1 μm to 0.5 μm.

17 . The circuit board of claim 16 , wherein the content of the first filler group satisfies a range of 1 wt % to 15 wt %,

wherein the content of the second filler group satisfies a range of 50 wt % to 70 wt %,

wherein the content of the third filler group satisfies a range of 15 wt % to 35 wt %, and

wherein a content of the fourth filler group satisfies a range of 5 wt % to 20 wt %.

Assignments (1)

Priority Claims (2)

Continuity (1)

References Cited (15)