Patent Assignment
Reel/Frame 063884/0422
Assignment of Assignor's Interest
Recorded: 2023-06-07
Pages: 4
Assignors
LEE, YONGKOON
Executed: 2023-01-06
KO, YOUNGCHAN
Executed: 2023-01-06
KIM, BYUNGHO
Executed: 2023-01-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Application:
18/298,702 →
Publication:
US 2024/0014197