Patent Assignment
Reel/Frame 063887/0364
Assignment of Assignor's Interest
Recorded: 2023-06-07
Pages: 4
Assignors
WU, ZONG-JIE
Executed: 2020-05-15
WANG, CHIAO-CHI
Executed: 2020-05-15
TSENG, CHUNG-CHUAN
Executed: 2020-05-15
LAI, CHIA-PING
Executed: 2020-05-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device