IP Library › Assignment 063887/0376
Patent Assignment
Reel/Frame 063887/0376

Assignment of Assignor's Interest

Recorded: 2023-06-07 Pages: 4
Assignors
HSIUNG, TE-CHIH
Executed: 2021-03-31
WANG, PENG
Executed: 2021-03-31
LIN, HUAN-JUST
Executed: 2021-03-31
WU, JYUN-DE
Executed: 2021-03-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Etch Profile Control of Gate Contact Opening
Application: 18/329,472 →
Publication: US 2023/0326978
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 15, 2023
From: HSIUNG, TE-CHIH; WANG, PENG; LIN, HUAN-JUST; WU, JYUN-DE
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 063961/0870 →