Patent Assignment
Reel/Frame 063892/0752
Assignment of Assignor's Interest
Recorded: 2023-06-08
Pages: 4
Assignors
SU, CHUNG-HAO
Executed: 2023-05-15
TU, WEN-CHIUNG
Executed: 2023-05-14
WANG, HSING-HSIANG
Executed: 2023-05-16
HUANG, CHEN-CHIU
Executed: 2023-05-11
SHEN, HSIANG-KU
Executed: 2023-05-14
CHEN, DIAN-HAU
Executed: 2023-05-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Opening in Passivation Layer and Structures Thereof