Patent Assignment
Reel/Frame 063912/0360
Assignment of Assignor's Interest
Recorded: 2023-06-09
Pages: 3
Assignors
MATSUHAMA, MAKOTO
Executed: 2023-04-26
TERAKADO, TOMOJI
Executed: 2023-04-26
AWANE, YUSUKE
Executed: 2023-04-26
Assignee
HORIBA, LTD.
2, MIYANOHIGASHI-CHO, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8510, JAPAN
Covered Property
(1)
Semiconductor Laser Element, Semiconductor Laser Device, Semiconductor Laser Device Manufacturing Method, and Gas Analysis Device
Application:
18/266,478 →
Publication:
US 2024/0030683