Patent Assignment
Reel/Frame 063919/0170
Assignment of Assignor's Interest
Recorded: 2023-06-12
Pages: 6
Assignors
CHUNG, CHI-HSIEN
Executed: 2022-12-30
WANG, TZU-JUI
Executed: 2022-12-20
HSU, TZU-HSUAN
Executed: 2023-06-10
WANG, CHEN-JONG
Executed: 2022-12-21
YAUNG, DUN-NIAN
Executed: 2022-12-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stacked Cmos Image Sensor with Sti-Free Photodetector Isolation and Method for Forming the Same
Application:
18/150,372 →
Publication:
US 2024/0072090