Patent Assignment
Reel/Frame 063919/0262
Assignment of Assignor's Interest
Recorded: 2023-06-12
Pages: 6
Assignors
IZAWA, HIROYUKI
Executed: 2023-06-06
MURAI, HIKARI
Executed: 2023-05-26
TAKANO, NOZOMU
Executed: 2023-05-24
AKAI, KUNIHIKO
Executed: 2023-05-24
ITOH, YUKA
Executed: 2023-05-24
OHKOSHI, MASASHI
Executed: 2023-05-24
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Substrate with Built-in Components, and Substrate with Built-in Components
Application:
18/019,636 →
Publication:
US 2023/0397337
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.