Patent Assignment
Reel/Frame 063919/0321
Assignment of Assignor's Interest
Recorded: 2023-06-12
Pages: 6
Assignors
TSAI, TSUNG HSIEN
Executed: 2023-06-05
HUANG, CHENG YU
Executed: 2023-01-17
LIU, JEN-CHENG
Executed: 2023-02-13
CHOU, KENG-YU
Executed: 2023-01-17
CHEN, MING-EN
Executed: 2023-01-30
TING, SHYH-FANN
Executed: 2023-01-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
High Aspect Ratio Back Side Deep Trench Isolaton Structure with Substrate-Embedded Metal Grid and No Pinch Off
Application:
18/155,096 →
Publication:
US 2024/0243156