Patent Assignment
Reel/Frame 063922/0843
Assignment of Assignor's Interest
Recorded: 2023-06-12
Pages: 4
Assignor
GUYADER, FRANCOIS
Executed: 2023-06-06
Assignee
STMICROELECTRONICS (CROLLES 2) SAS
850 RUE JEAN MONNET, CROLLES, 38920, FRANCE
Covered Property
(1)
Method of Wafer Assembly by Molecular Bonding
Application:
17/384,418 →
Publication:
US 2022/0037157
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.