IP Library › Assignment 064111/0771
Patent Assignment
Reel/Frame 064111/0771

Assignment of Assignor's Interest

Recorded: 2023-06-26 Pages: 4
Assignor
BESSON, PASCAL
Executed: 2023-06-23
Assignee
STMICROELECTRONICS SA
29 BOULEVARD ROMAIN ROLLAND, MONTROUGE, 92120, FRANCE
Covered Property (1)
Method of Wafer Assembly by Molecular Bonding
Application: 17/384,418 →
Publication: US 2022/0037157
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 12, 2023
From: GUYADER, FRANCOIS
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 063922/0843 →
Change of Name Jan 10, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066254/0070 →