IP Library › Assignment 063927/0152
Patent Assignment
Reel/Frame 063927/0152

Assignment of Assignor's Interest

Recorded: 2023-06-12 Pages: 2
Assignors
HERRAULT, FLORIAN
Executed: 2023-01-13
RIVERA, ISAAC
Executed: 2023-01-14
GREEN, DANIEL S.
Executed: 2023-01-16
BUCKWALTER, JAMES F.
Executed: 2023-01-13
Assignee
PSEUDOLITHIC, INC.
1114 CORTO CAMINO ONTARE, SANTA BARBARA, CALIFORNIA, 93105
Covered Property (1)
Chip Integration into Cavities of a Host Wafer Using Lateral Dielectric Material Bonding
Application: 18/333,460 →
Publication: US 2024/0243026