Patent Assignment
Reel/Frame 063933/0233
Assignment of Assignor's Interest
Recorded: 2023-06-13
Pages: 6
Assignors
ISHIBASHI, SHUICHI
Executed: 2023-05-25
FUJIMOTO, DAISUKE
Executed: 2023-05-25
KOTAKE, TOMOHIKO
Executed: 2023-05-25
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN
Covered Property
(1)
Method for Evaluating Compatibility of Thermosetting Resin Composition, Thermosetting Resin Composition, Prepreg, Resin Film, Laminated Plate, Multilayer Printed Wiring Board, and Semiconductor Package
Application:
18/257,146 →
Publication:
US 2023/0392002
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.