Patent Assignment
Reel/Frame 063941/0090
Assignment of Assignor's Interest
Recorded: 2023-06-14
Pages: 5
Assignors
CHU, LI-WEI
Executed: 2022-06-14
LIAO, YU-HSIANG
Executed: 2022-06-14
CHEN, HUNG-HSU
Executed: 2022-06-22
CHANG, CHIH-WEI
Executed: 2022-06-22
TSAI, MING-HSING
Executed: 2022-06-14
SU, YING-CHI
Executed: 2023-06-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof