Patent Assignment
Reel/Frame 063954/0037
Assignment of Assignor's Interest
Recorded: 2023-06-14
Pages: 3
Assignors
LIN, BO-JIUN
Executed: 2023-06-05
LEE, TSUNG-EN
Executed: 2023-06-11
LEE, TUNG-YING
Executed: 2023-06-04
CHENG, CHAO-CHING
Executed: 2023-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Compositionally Varied Hafnium-Containing Dielectric Layers and Fabrication Method Thereof
Application:
18/333,508 →
Publication:
US 2024/0413222