Patent Assignment
Reel/Frame 063958/0119
Assignment of Assignor's Interest
Recorded: 2023-06-15
Pages: 4
Assignors
LOH, AI YUN
Executed: 2023-04-27
ABDUL RANI, BADRUS HISHAM
Executed: 2023-05-18
LOW, HWEE YIN
Executed: 2023-05-17
FAUZI WAHID, MUHAMAD HAIRUL
Executed: 2023-05-18
JASON LIM, WEE AUN
Executed: 2023-04-27
Assignee
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2, VILLACH, 9500, AUSTRIA
Covered Property
(1)
Semiconductor Package and Method for Marking a Semiconductor Package
Application:
18/137,014 →
Publication:
US 2023/0352422