Patent Assignment
Reel/Frame 063962/0233
Assignment of Assignor's Interest
Recorded: 2023-06-15
Pages: 5
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Substrate Processing Apparatus
Application:
18/267,596 →
Publication:
US 2024/0044006