Patent Assignment
Reel/Frame 063964/0419
Assignment of Assignor's Interest
Recorded: 2023-06-15
Pages: 14
Assignors
MU, QIANLI
Executed: 2020-06-13
BARTON, HEATHER
Executed: 2023-06-13
NOORI, BASIM
Executed: 2023-06-13
NAMISHIA, DAN
Executed: 2023-06-14
ETTER, DAN
Executed: 2023-06-13
KOMPOSCH, ALEXANDER
Executed: 2023-06-13
Assignee
WOLFSPEED, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property
(1)
Packaged Device Having an Integrated Passive Device with Wafer Level Formed Connection to at Least One Semiconductor Device and Processes for Implementing the Same
Application:
18/334,527 →
Publication:
US 2024/0421053
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.