Patent Assignment
Reel/Frame 063981/0331
Assignment of Assignor's Interest
Recorded: 2023-06-17
Pages: 4
Assignors
HOU, TE-CHIEN
Executed: 2023-06-01
TANG, CHEN-CHI
Executed: 2023-06-01
SHEN, CHI-HSIANG
Executed: 2023-05-31
LIN, JENG-CHI
Executed: 2023-05-30
WU, CHEN-HAO
Executed: 2023-06-01
SUEN, SHICH-CHANG
Executed: 2023-05-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Apparatus and Methods for Chemical Mechanical Polishing