Patent Assignment
Reel/Frame 063986/0274
Assignment of Assignor's Interest
Recorded: 2023-06-19
Pages: 4
Assignors
CHEN, SHENG-HSIUNG
Executed: 2019-09-17
WANG, SHAO-HUAN
Executed: 2019-09-17
CHEN, WEN-HAO
Executed: 2019-09-17
KU, CHUN-YAO
Executed: 2019-09-17
OU, HUNG-CHIH
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming Same and a System